CPP 2008 is again co-located this year with Pack Expo and Process Expo at Chicago’s McCormick Center, running Nov. 9-13. The show’s organizers, H.A. Bruno LLC, say they decided to co-locate the event with Pack Expo and Process Expo so that attendees could better observe the full supply chain of the packaging industry in one place. With one badge, attendees can enter any of the co-located events.
At CPP Expo, visitors will be able to witness the evolution of new technologies in package printing, from digital pre-press and workflow solutions to finishing processes, such as slitting, rewinding, coating and laminating. Also, the extensive marketing and promotional efforts that go into Pack Expo help boost CPP’s prominence, allowing it to offer more insight into the package printing segment of the industry. The first year that CPP co-located the event-2005 in Chicago-it was able to attract 6,140 attendees. This year it expects to welcome more than 7,000 visitors.
In terms of who attends these co-located events, in the past the breakdown has been: 60% were involved in packaging machinery and related services; 15% of attendees were involved in package printing, machinery and related supplies/services; and the remaining 15% worked with processing machinery and related supplies and services.
Learning opportunities abound
On the conferences and special sessions end of CPP Expo, there are several offerings for flexible packaging visitors, in addition to sessions sponsored by the other two events. A sampling of the seminars being offered include: “Trends and Opportunities for Labels and other Package Decorations;” “FIRST 4.0: Flexographic Image Reproduction Specifications and Tolerances;” “FDA and Sustainable Food Printing & Packaging Implications with UV/EB Curing Part 1;” and “Increase Profits by Aligning Your Assets.” Expert presenters include Mickey Fortune, vice president of RadTech; Giancarlo Ciammi, vice president at Nordmeccanica Group and others.
Visitors to CPP Expo can also take advantage of the many events and sessions going on at Pack Expo and Process Expo. The keynote address at Pack Expo is entitled “More Safety vs. Less Material? Where Does Packaging Go?” which is expected to dovetail with the conference’s overall theme of “Change, Innovation and Sustainability.” It will be delivered by Betsy Cohen, vice president of sustainability at Nestlé.
A variety of other attractions at Pack Expo will pertain to attendees of CPP Expo, such as its Showcase of Packaging Innovations, RFID (radio frequency identification) Pavilion and Brand Protection Center.
On the processing side of the co-located event, Process Expo will focus on the newest developments in processing technology. Exhibitors will demonstrate equipment, products and service solutions in the bakery, beverage, confectionery, dairy, fruit and vegetable, ingredients and flavors, meat, pharmaceutical, prepared and snack food industries.
What:Converting & Package Printing Expo (CPP Expo); Co-located with Pack Expo and Process Expo
When:Nov. 9-13, 2008
Where:Lakeside Center-McCormick Place, Chicago