Thin Film Electronics ASA, a leader in development of printed electronics, and Bemis Company, Inc, a Fortune 500 supplier of flexible packaging and pressure sensitive materials, announces an agreement to develop a flexible sensing platform for the packaging market. The result will be a new category of packaging that can collect and wirelessly communicate sensor information, for use by leading food, consumer products and healthcare companies worldwide.
Thinfilm has previously announced technology partnerships to
develop an inexpensive, integrated time-temperature sensor for use in
monitoring perishable goods and pharmaceuticals. Under the agreement with
Bemis, Thinfilm will extend this work to create a customizable sensor platform
that Bemis will subsequently tailor to its customers’ individual requirements.
The Intelligent Packaging Platform can be adapted to monitor and record key
physical properties and environmental data in packaged perishable products.
“Intelligent packaging is an emerging technology with many
potential intersections with Bemis’ flexible packaging and pressure sensitive
materials business segments,” says Henry Theisen, Bemis Company president and chief
executive officer. “Our agreement with Thinfilm represents an investment in a
technology that could eventually make printed electronics a component of every
package we manufacture.”
Bemis’ packaging is used for a wide range of products from
meat and cheese to medical devices and personal care items. Its customers
include leading food and consumer products companies around the world.
The flexible packaging market for North America alone is
estimated by PCI Films Consulting Ltd to be $18.3 Billion.
“These are exciting times for the printed electronics
market, where innovative solutions that simply could not be manufactured before
are soon to be delivered,” says Davor Sutija, CEO, Thinfilm. “Our partnership with
Bemis will lead to new categories and types of packaging that will bring
intelligence to the everyday lives of millions of people worldwide. We are
excited to work with the company because of their distinguished history of
innovation and their vision for printed electronics.”
“The relationship between Bemis and Thinfilm is a clear sign
that the printed electronics market is entering a new commercial phase. While
vendors have created standalone components, the integrated systems
commercialized through this partnership are truly disruptive,” says Dr. Malcolm
J. Thompson, founder and director emeritus of the FlexTech Alliance. “Vendors
who have waited to see what printed and flexible electronics can offer should
take this as a strong sign that now is the time to be seriously evaluating the
new product opportunities that printed electronics can generate.”
The Bemis Intelligent Packaging Platform is expected to be
commercially available in 2014.
Bemis Selects Thin Film Electronics to Develop Intelligent Packaging Platform
July 10, 2012