The Dow Chemical Company will showcase its broad portfolio of innovative packaging solutions, including three new high-performance resins, at the Dow Customer Center at Pack Expo International 2012, October 28-31 in Chicago. As the largest material supplier to the $500 billion global packaging sector, Dow will highlight the latest solutions for better packaging at this year’s show, covering a range of packaging requirements and applications, including films and foams, food and specialty packaging, film substrates, adhesives and rigid packaging.
Among the new resins being
introduced at Pack Expo are ELITE AT resins which target stretch wrap
and stretch hood applications. These high-performance resins offer exceptional
processing performance while enabling enhanced toughness in a thin film
structure. Other new ELITE AT resins offer potential advantages for high-speed
packaging applications with excellent sealant properties, as well as
low-temperature sealing and impact resistance.
The Dow Chemical Company
Dow Offers Solutions for Better Packaging at Pack Expo International 2012
September 17, 2012