FPA Update May 2012: FPA's 2012 Flexible Packaging Internship & Scholarship Program
Established in 2005, the Flexible Packaging Internship & Scholarship Program provides career development opportunities for packaging and printing (or other areas of concentration utilized in the converting industry) school students, and encourages them to pursue careers in the flexible packaging industry. Through the Program, FPA has awarded $78,000 in flexible packaging academic scholarships to students successfully completing internships with FPA converter members including American Packaging Corporation, AMGRAPH Packaging, Incorporated, Beacon Converters, Incorporated, Berry Plastics Corporation, CL&D Graphics, Incorporated, Constantia Hueck Foils LLC, North State Flexibles, LLC, Sonoco Flexible Packaging, and Technipaq, Incorporated.
This summer, printing school students Jon Spatafore and Andrea Grumbir will acquire hands on experience in the flexible packaging industry and learn more about flexible packaging manufacturing. Jon, a graphic and printing science major at Western Michigan University will participate in a summer internship with American Packaging Corporation at their Columbus, Wisconsin facility. During his internship, Jon will work on projects in the printing division.
Andrea, also a graphic and printing science major and student at Western Michigan University, has accepted an internship with CL&D Graphics as a printing department intern at their Oconomowoc, Wisconsin manufacturing facility. Her internship will include working on projects that provide a greater understanding of flexible packaging printing techniques, color management and ink quality testing.
At the successful completion of their internship, Jon and Andrea will each receive a FPA academic scholarship valued at $3,000. For more information about the 2012 FPA Flexible Packaging Summer Internship & Academic Scholarship Program, contact FPA at (410) 694-0800 or visitwww.flexpack.org