During Interpack 2014, Sun Chemical and its parent company, DIC, will introduce its new SunLam lamination adhesives range.
Sun Chemical and DIC Launch SunLam Lamination Adhesives Technology
May 13, 2014
On display at Sun Chemical’s booth located at Stand C10/Hall 7a, the SunLam family of performance lamination adhesives. Initially developed by DIC for the demanding Asian market to offer optimal performance, even with challenging food products and processing conditions.
Colin Smith, European product manager of Sun Chemical says: “Brand owners are looking for flexible packaging solutions that can replace some of the historic rigid packaging applications. While retaining or improving upon current barrier properties of the structure which has, in most cases, a direct effect on the shelf life and integrity of the product. SunLam adhesives do just that. They can have a significant effect in terms of product resistance and high temperature stability. The latest oxygen barrier adhesive technology also gives the opportunity for lightweighting, reducing cost & complexity, while maintaining overall performance."
The SunLam family of lamination adhesives consists of water based, solvent free and solvent based products designed to meet the needs of all the major flexible packaging applications globally.