Home » Heinz and Kodak Confirmed to Speak at AMI's Multilayer Film 2014 Conference
Packaging markets are growing and developing across the globe to preserve vital foodstuffs, pharmaceuticals and other sensitive materials. At the same time the technology is improving as scientists and engineers work together to enhance the properties of the materials and expand the applications and product shelf-life.
Flexible packaging has the big advantage of lowering weight and bulk, which cuts material and transport costs and this has led to a trend towards flexible liquid packaging and away from rigid containers.
AMI has once again gathered an expert panel of speakers to discuss all the current issues of the industry.
Multilayer Packaging Film 2014 will open with a market overview, with presentations from Heinz, TNO Triskelion and AMI.
The following session will explore barrier films for shelf-life extension including papers from R.O.P Ltd. and Tosaf Compounds, both Israeli companies, as well as Eval Europe (Kuraray) and UBE Engineering Plastics S.A. who will look at the development of EVOH and the use of copolyamides and terpolyamides in the packaging market. The CEO of Smurfit Kappa Bag-in-Box will also cover packaging trends in drinks and dairy.
Several papers throughout the conference will look at how careful selection of materials and additives provides tailored properties for each packaging application, with high barrier polymers interlayered with polyolefin materials in multilayer film structures. Companies such as Hosokawa Alpine AG, Buergofol GmbH, Gap S.r.l., Mitsui Chemicals Europe GmbH and ExxonMobil.
Plantic Technologies Ltd. and Ghent University/Pack4Food will offer a biobased perspective.
Multilayer Packaging Films 2014 will also feature a session entitled ‘Enhancing Manufacturing’ which includes Piovan, Electronic Systems S.p.A. and Kodak who will present their approach to flexo-printing.
The full program can be viewed on the AMI website.
The conference is sponsored by industry players Mitsui Chemicals Europe GmbH, Piovan, Tosaf Compounds, Kuraray – Eval Europe N.V., Industrie Polieco-MPB S.r.l., Electronic Systems S.p.A. and A. Schulman Plastics BVBA.
In addition to delivering quality papers Multilayer Film 2014 also offers superb and cost-effective networking opportunities with its extensive table top exhibition area. Exhibitors already booked for the event include Colines S.p.A., Erema Engineering Recycling Maschinen Und Anlagen Ges.m.b.H, Mahlo GmbH & Co. KG, NDC Infrared Engineering Ltd., Nordson Extrusion Dies Industries LLC, Paul Lippke Handels GmbH, Polyram/Velox, Sojitz Europe PLC and Systech Instruments Ltd.
The event regularly attracts over 160 participants and is an ideal place to make new contacts in the industry.
What’s changed about this year’s PACK EXPO International because of the pandemic? Nothing! Well, just the name. And format. But you can still make connections and see the latest trends. Get the lowdown on PACK EXPO Connects with Flexible Packaging’s preview in the October issue! Also, see how Midwest values helped bring two companies together when one of them was looking to bring pouch converting in-house. Find out what’s driving automation investments for converters and much more!