Dow Packaging and Specialty Plastics and Nordmeccanica have announced the launch of a revolutionary lamination technology, using both adhesive and machinery hardware advancements. SYMBIEX Solventless Adhesives, Dow’s new ultra-fast curing adhesive technology, combined with the innovative Duplex SL One Shot lamination line from Nordmeccanica, redefines packaging lamination, offering converters best-in-class conversion efficiency improvements, shorter time-to-market and total conversion cost reductions.

Other benefits include:

  • Conversion efficiency improvements: no mixer and no pot life concerns .
  • Lower cost-in-use: reduced line downtime and curing inventory.
  • Ability to form a package in less than one day from lamination, and achieve food compliance within one day for most film structures.
  • Very high web speeds and may offer increased speeds on metallized and foil laminations versus conventional solventless.
  • No misting and better wettability.
  • Eliminates adhesive scrap.
  • Reduced line downtime for cleaning, reduced curing inventory.
  • Bond-quality checking possible 30 minutes after lamination.

Compared to a conventional lamination line, the Duplex SL One Shot laminator features a unique system to handle the solventless lamination process, enabling the two adhesive components to come into contact as late as possible in the lamination process.

With two independent high-precision coating stations, the two films are pressed together only in the lamination nip station where the curing of the adhesive takes place. This process eliminates the need of a mixing unit and any pot life concerns, and offers reduced line downtime and easy cleaning.