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Toray Plastics (America) is sending the message at Pack Expo International 2014 that films "Made in the USA", sourcing advantages and sustainability are important distinctions to consider when choosing a packaging film partner.
In an industry constantly optimizing materials, design and processing technologies, it’s hard to keep pace, let alone apply new technologies to your advantage.
Neil Kozarsky, CEO and president of Technical Help in Engineering and Marketing, will deliver a presentation on Snapsil, a new, easy-open thermoformed packaging technology on Tuesday, Nov. 4, 11:30 am at Pack Expo 2014 in Chicago at the Bemis Co. exhibit.
Dr. Gregory Pace, a manager of global regulatory affairs at Sun Chemical, will discuss the design of low-migration inks and coatings for safe and sustainable packaging during a seminar on Nov. 3 at 2:00 p.m. during Pack Expo 2014.
During Pack Expo 2014, Sun Chemical will show how it can take customers from concept to consumer through its full range of solutions for the packaging markets, from packaging design/brand consultancy, pre-press services with high-definition digital plate technology, and low migration to brand protection, conductive materials for smart device interaction, and inks, coatings, and consumables.
With over 45,000 attendees and nearly 3,000 exhibitors expected to flood Chicago’s McCormick Place on Nov. 2-5, many people in the packaging industry might consider Pack Expo 2014 to be a pretty big deal in itself.
FPA is helping advance the flexible packaging industry by partnering with one of the largest tradeshows in North America for processing and packaging professionals – PACK EXPO International