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Sebastian Huennefeld, technical sales manager of extrusion systems at Windmoeller & Hoelscher, provides his well-honed insight on saving time and money in the blown film sector.
Three major flexible packaging industry events highlighting the latest technologies, networking opportunities and milestone achievements take place within a 30-day time frame.
The development and gradual commercialization of NFC-enabled (Near Field Communication) products show how companies such as Thin Film Electronics (Thinfilm) are pushing the integration of electronic intelligence into everyday products, like packaging labels.
The constantly changing consumer demand of the flexible packaging market is the driving force behind the enhancement of its supply chain – particularly, the labeling sector.