Dow presents new ADCOTE L76-500 high-solids adhesive for high speed metal lamination. The solvent-based adhesive enables production efficiency with good wettability on aluminium and metallized films.

Dow is working together with Mespack, one of the leading manufacturers of horizontal form/fill/seal (HFFS) packaging machines, to develop a holistic understanding of the processability and machinability of stand-up pouches being designed for recyclability.

Dow has announced the winners of the 2019 Packaging Innovation Awards, which recognize the packaging industry’s top achievements in innovative packaging design, materials, technologies and processes.

The Showcase of Packaging Innovations will return to PACK EXPO Las Vegas, highlighting top packaging designs from around the globe.

Submissions for the international awards program will be accepted from Jan. 22 through March 29 on the Dow Packaging Innovation Awards website. 

TC Transcontinental Packaging is launching one of the first-in-market, 100 percent recyclable, multilayer barrier standup pouches in North America in partnership with Harney & Sons, an American tea company, for its loose tea flexible plastic pouch. 

Berry Global, NOVA Chemicals, BASF, Dow and Henkel are among more than 25 companies that have joined The Alliance to End Plastic Waste, a new, non-profit organization that aims to partner with the finance community, government and civil society to eliminate environmental plastic waste.

Dow and Keep America Beautiful have awarded two $40,000 grants to organizations in Cobb County, Georgia, and Lincoln, Nebraska. 

Elba, Dow and ITP have worked together to develop a laminated film that allows for recyclability, while keeping features such as packaging integrity and hermeticity in place. Elba will have this – and more – on display at PACK EXPO

The Dow Chemical Company has announced the winners of its 2018 30th Awards for Packaging Innovation, which recognizes the packaging industry’s top achievements in innovative packaging designs, materials, technologies and processes.