PACK EXPO International attendees reunited in Chicago for the first time since 2018.

The EDI Prodigi die system, a more responsive APC (automatic profile control) die for cast film, sheet and extrusion coating applications. 

With its DIGILINE Vario, Atlantic Zeiser presents for the first time a system for full-color inline printing of flexible narrow web materials such as foils for lidding applications or flexible laminates for pouching or tube converting applications.

Increasing consumer convenience, reducing waste, and improving packaging recyclability.

ULMA continues expansion of ULMAweCare sustainable solutions.

From bagging equipment to robotic palletizing, the latest innovation in packaging equipment is debuted at PACK EXPO International. Here are just a few of the new machinery advances being demonstrated in Chicago.

JLS will showcase its Osprey case packer’s latest feature, which allows for vertical pack of stand-up pouches (SUP), at PACK EXPO. 

The competition is designed to encourage high school students to get creative while inspiring the next generation in packaging.